Argus

  • By integrating a vision system, the robot can accurately recognize wafers inside the FOUP, ensuring precise handling and preventing scratches.
  • Main Advantages

    1. Misalignment Detection – Capable of identifying front tilt, stacking, and slanted wafers.

    2. Safe Handling Clearance – Maintains a minimum distance of 1.5 mm between the finger and wafer.

    3. Warpage Detection – Detects wafer warpage of 3 mm or more.

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  • TEL : 03-5774241
  • E-mail : Superplus@superplus.com.tw
  • Business Hours : Mon-Fri 09:00〜18:00
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